Blue M Advantage TCS

The ADVANTAGE Thermal Curing Solution (TCS) is the latest total thermal conditioning, curing and treatment system from Blue M. ADVANTAGE TCS has been designed for use by your development and process engineering team, and is the most robust system available for process development or low volume production.

The ADVANTAGE TCS supports your most demanding low volume production needs with a 1-chamber or 2-chamber system. Using the ADVANTAGE TCS system, you can easily transition any high volume production requirement to the Blue M MicroBatch II Inline Curing Oven using the same profiles developed for copy exact deployment.

Features

  • Precision thermal process control
  • Temperature range: 30°C - 250°C (optional 300°C)
  • Active product cooling
  • Inert atmosphere/gas purge
  • Active effluent material removal
  • PC-control
  • Built-in safety features, and
  • Lead-screw drive door for ergonomicproduct handling

ADVANTAGE TCS

  • 1-Chamber System
  • Manually Controlled
  • Watlow Temperature Controller
  • 1-16 Step Profile Capability
  • Auto Active Cooling after Cure
  • Inert Atmosphere/Gas Purge

ADVANTAGE TCS 1

  • 1-Chamber System PC Controlled
  • Watlow Temperature Controller
  • 16-Independent Multi-Step Profiles
  • Auto Active Cooling after Cure
  • Inert Atmosphere/Gas Purge

ADVANTAGE TCS 2

  • 2-Chamber System PC Controlled
  • Watlow Temperature Controller
  • 16-Independent Multi-Step Profiles
  • Auto Active Cooling after Cure
  • Inert Atmosphere/Gas Purge

ADVANTAGE TCS Options

  • 32-Channel Thermal Data Management System and Blue M CTDM Software Package
  • PC and Monitor (Pentium Class)
  • Laptop (Pentium Class)
  • Stand
  • Communications and Thermal Data Management (CTDM) Software Site License
  • Active Water Cooling Requires Customer System Plumbing for All ADVANTAGE Systems
  • Blue M can Supply Optional Open Loop, Closed Loop, or Stand-Alone Cooling Systems based on Customer Requirements; please contact Blue M for Pricing

Blue M Advantage TCS Specifications

Power Purge Gas (Typical) Water Input Air
240 VAC 50/60
Single Phase
13.5 A
Nitrogen (>99.998%)
60-90 PSI Pressure Range
50-200 SCFH Per Chamber (adjustable)
1 GPM/Chamber
45-65 PSI (FILTERED)
PH-7
18BC - 25BC
40-60 PSI
140 SCFH

Approximate Overall Maximum Advantage TCS Chamber Dimensions (LxWxH)
Internal: 22.0 x 21.0 x 9.0 (inches)
External: 40.0 x 30.0 x 16.0 (inches)

Advantage Functionality
Watlow Controller initiated 16-step cure profile recipe.  Manual Gas or Air Purge / Active Cooling after Cure (Water or CDA)

TCS1, TCS2 Control Functionality
PC / SW control over 16 individual multi-step profiles.  Gas / Air Purge and Active Cooling after Cure.   Highly graphical process visualization from PC Monitor of temperatures, profiles, thermal recipes.  Thermal Data Management software supports optional 32 or 64 thermocouple capability for sophisticated characterization and profiling challenges.   Visual and / or Audible Alarms.

Applications

  • Curing
  • Die Attach Cure
  • Die Coat Cure
  • Heat Sink Attach Cure
  • Ink Mark Cure
  • Medical Component Cure
  • Optoelectronic Cure
  • Post Mold Cure
  • Print Cartridge Cure
  • Underfill Cure

Industries

  • Automotive
  • Automotive Component Cure
  • Computer Peripherals
  • Defense
  • Medical Components
  • Optical Electronics